Products information

General PWB
Product proposal

Copper paste Board¡Ê£Ó£Ù£Ã¡Ë

¡¦It is possible to reduce the cost of the substrate than the silver paste.
¡¦ Since compared with the silver paste there is no worry of migration,
It can be used for a wide range of applications.

It will not satisfy the criteria of reliability evaluation, which is determined by the implementation industry.

¢¨CEM-3 t=1.6mm¡¡¦Õ0.5mm

item Property case
¡Ê¡öThere is no standard values¡Ë
note
High-temperature stress Before 15mΩ⇒After 28mΩ (¡Ü87%) 100¡î/2000hr
Low temperature stress Before 15mΩ⇒After 15mΩ ( 0%) -55¡î/2000hr
PCT Before 15mΩ⇒After 18mΩ(¡Ü20%) 121¡î/98%RH/196kPa/16hr
Hot Oil stress Before 15mΩ⇒After 15mΩ(0%) 260¡î/10sec/¡Ü20¡î/10sec×200cy
Thermal shock Before 15mΩ⇒After 20mΩ(¡Ü33%) -65¡î/30min¡Ü125¡î/30min×2000cy
Reflow heat test Before 15mΩ⇒After 16mΩ(¡Ü7%) 250¡î×£¶cy
Bending test Before 15mΩ⇒After 16mΩ(¡Ü7%) 5%wrap×100cy
Solder heat test Before 15mΩ⇒After 14mΩ(-7%) 260¡î/5sec×6cy
Bias test P=1.45mm 2000hr¡ã9×1011Ω¡¦cm 60¡î/90%RH/DC50V/2000hr
Tg 250¡î TMA
Moisture absorptivity 30% JEDEC L4
a1 29ppm(20¡î) X-ray
Design criteria of copper paste through-hole
Design specification (MIN)
Drill diameter Pitch Land
diameter
Copper paste
diameter
Over coat
diameter
thickness
φ0.45 1.5mm 1.2mm 0.8mm 1.8mm 1.6mm

¢¨With regard to the design specification, let me arrangements separately.