General PWB
Product proposal
Copper paste Board¡Ê£Ó£Ù£Ã¡Ë
¡¦It is possible to reduce the cost of the substrate than the silver paste.
¡¦ Since compared with the silver paste there is no worry of migration,
It can be used for a wide range of applications.
It will not satisfy the criteria of reliability evaluation, which is determined by the implementation industry.
¢¨CEM-3 t=1.6mm¡¡¦Õ0.5mm
| item | Property case ¡Ê¡öThere is no standard values¡Ë |
note |
|---|---|---|
| High-temperature stress | Before 15mΩ⇒After 28mΩ (¡Ü87%) | 100¡î/2000hr |
| Low temperature stress | Before 15mΩ⇒After 15mΩ ( 0%) | -55¡î/2000hr |
| PCT | Before 15mΩ⇒After 18mΩ(¡Ü20%) | 121¡î/98%RH/196kPa/16hr |
| Hot Oil stress | Before 15mΩ⇒After 15mΩ(0%) | 260¡î/10sec/¡Ü20¡î/10sec×200cy |
| Thermal shock | Before 15mΩ⇒After 20mΩ(¡Ü33%) | -65¡î/30min¡Ü125¡î/30min×2000cy |
| Reflow heat test | Before 15mΩ⇒After 16mΩ(¡Ü7%) | 250¡î×£¶cy |
| Bending test | Before 15mΩ⇒After 16mΩ(¡Ü7%) | 5%wrap×100cy |
| Solder heat test | Before 15mΩ⇒After 14mΩ(-7%) | 260¡î/5sec×6cy |
| Bias test | P=1.45mm 2000hr¡ã9×1011Ω¡¦cm | 60¡î/90%RH/DC50V/2000hr |
| Tg | 250¡î | TMA |
| Moisture absorptivity | 30% | JEDEC L4 |
| a1 | 29ppm(20¡î) | X-ray |
Design criteria of copper paste through-hole
| Design specification (MIN) | |||||
|---|---|---|---|---|---|
| Drill diameter | Pitch | Land diameter |
Copper paste diameter |
Over coat diameter |
thickness |
| φ0.45 | 1.5mm | 1.2mm | 0.8mm | 1.8mm | 1.6mm |
¢¨With regard to the design specification, let me arrangements separately.
