Current mainstream manufacturing process for high-frequency wireless electronic circuit includes arranging antennas, filters, and baluns on a ceramic board and ultimately integrating them onto a PWB.
YKC, on the other hand, proposes the formation of element functions of each part on a PWB right from the beginning (which means that this is not a PWB with integrated components), as opposed to the combination of parts and a PWB.
Fewer parts and fewer implementation steps would enable a faster and less expensive wireless electronic circuit for PWB.
Comparison with rival technologies in high frequency electronic circuits | Performance (loss) | Design performance / Integration performance | Size | Cost | Manufacturing lead time |
LSI | ¡û | ¡û | ¡û | ¡ß¡ß | ¡ß |
LTCC ceramic PWB | ¡û | ¡û Distributed element model |
¡ý High-permittivity 20 or up |
¡û | ¡û |
Integrated component / Embedded PWB | ¡û | ¡ß | ¡û | ¢¤ | ¡ß |
PWB | ¡ß¢ª¡û Low loss materials |
¡ý Distributed element model |
¡û High-permittivity 10 or up |
¡ý | ¡ý |